電子元器件燒結石墨治具
電子元器件燒結模具用石墨，在完結地圖規劃并經工藝廠家流片后，能夠選用兩種辦法對芯片進行功能、功能測驗：一種辦法是直接鍵合到PCB（印制電路板）上，另一種辦法是經過封裝廠家進行封裝后，再焊接至體系中。而封裝辦法又可分為軟封裝與硬封裝，軟封裝首要依據運用要求直接制作成模塊，而硬封裝則是封裝成獨立的芯片。
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